Gaming Devices

Product Number MLW-D24M-A18PC-R2 Exterior Color Black CPU Socket LGA1700, LGA1200, LGA2066, LGA2011-v3, LGA2011, LGA1151, LGA1150, LGA1155, LGA1156, AM5, AM4, AM3+, AM3, AM2+, AM2, FM2+, FM2, FM1 Radiator Material Aluminum Radiator Dimensions 277 x 119.6 x 27.2 mm / 10..

Specifications General Specifications Series AMD Ryzen 5 CPU Cores 6 Threads 12 Max. Boost Clock Up to 4.0GHz Base Clock 2.1GHz L2 Cache 3MB L3 Cache 8MB Default TDP 15W AMD Configurable TDP (cTDP) 10-25W Processor Technology for CPU Cores TSMC 7nm FinFET CPU Socket FP..

MSI APP PLAYERDeveloped under an exclusive partnership with BlueStacks, the MSI APP Player brings seamless gaming experience between mobile games and PC platform, and leverages customized features as specific keyboard lighting and better graphics with multi-task works.FEATURESGEFORCE EXPERIENCECaptu..

CPU Supports AMD Ryzen™ 5000 & 3000 Series desktop processors (not compatible with AMD Ryzen™ 5 3400G & Ryzen™ 3 3200G) and AMD Ryzen™ 4000 G-Series desktop processors Chipset AMD® B550 Chipset Memory 4x DDR4 memory slots, supporting up to 128GB Supports DDR4 1866/ 2133/ 2400/..

Specifications Essentials   Product Collection 12th Generation Intel® Core™ i9 Processors Code Name Products formerly Alder Lake Vertical Segment Desktop Processor Number i9-12900K Status Launched Launch Date Q4'21 Lithography Intel 7 Use Conditions PC/Client/..

SpecificationsEssentials Product Collection 12th Generation Intel® Core™ i3 Processors Code Name Products formerly Alder Lake Vertical Segment Desktop Processor Number i3-12100F Status Launched Launch Date Q1'22 Lithography Intel 7 Recommended Customer Price $97.00 - $104.00 U..

Specifications Essentials Product Collection 10th Generation Intel Core i3 Processors Code Name Products formerly Comet Lake Vertical Segment Desktop Processor Number i3-10105F Status Launched Launch Date Q1'21 Lithography 14 nm Recommended Customer Price $97.00 Use Conditions ..

CPU LGA1700 socket: Support for the 13th and 12th Generation Intel® Core™, Pentium® Gold and Celeron® ProcessorsL3 cache varies with CPU(Please refer "CPU Support List" for more information.)Chipset Intel® B760 Express ChipsetMemory Support for DDR5 7..

Dimensions (L x W x H) Chassis Size: 416 x 210 x 452 mm Packing Size: 508 x 278 x 492 mm Motherboard Type E-ATX, ATX, Micro-ATX, Mini-ITX Drive Bays 3.5Inch x2 2.5Inch x4 Fan Support Front: 120mm x3 Top: 120/140mm x2 Bottom: None Rear: 120mm x1 Liquid Cooling Support(Maximum) Fr..

SPECIFICATIONS Brand ‎Samsung Manufacturer ‎Samsung, Samsung Electronics Co., Ltd. Semiconductor Business Test & Package Center, #158 Baebang-Ro Baebang-Eup, Asan-city Chungcheongnam-Do, 31489 Republic of Korea Model ‎MZ-77E250BW Model Name ‎870 EVO Product Dimensions ‎10 x 7 x 0..

Specifications Essentials   Product Collection 12th Generation Intel® Core™ i7 Processors Code Name Products formerly Alder Lake Vertical Segment Desktop Processor Number i7-12700K Status Launched Launch Date Q4'21 Lithography Intel 7 Use Conditions PC/Client/..

Graphics Processing GeForce RTX™ 4060 Core Clock 2505 MHz (Reference card: 2460 MHz) CUDA® Cores 3072 Memory Clock 17 Gbps Memory Size 8 GB Memory Type GDDR6 Memory Bus 128 bit Card Bus PCI-E 4.0 Digital max resolut..